| 汉高乐泰-爱玛森康明导电胶 |
 |
|
Product |
Description |
Dispense Method |
Viscosity
(cps) |
|
Die and Component Attach |
|
|
High purity, die attach adhesive |
Screen or
Stencil |
60,000 |
|
|
Low viscosity, high thermal conductivity, excellent adhesion to gold |
Syringe |
22,000 |
|
|
High temperature resistant, high strength, excellent adhesion to gold |
Screen or
Stencil |
19,000 |
|
|
Low temperature cure |
Screen or
Syringe |
14,000 |
|
|
Flexible, low viscosity |
Screen or
Syringe |
9,000 |
|
|
Microelectronic grade, stress absorbing |
Screen or
Stencil |
61,000 |
|
|
Microelectronic grade, superior dispense performance (mil spec version available) |
Screen or
Syringe |
30,000 | |
|
